SEMI forecasts that advanced process capacity (7nm and below) will surge 69% from 850,000 wafers per month in 2024 to 1.4 million wafers per month by 2028, representing a 14% CAGR. The milestone of surpassing one million wafers per month is expected in 2026. Capital expenditure on advanced process equipment is forecast to exceed $50 billion by 2028.
NEWS
NVIDIA Blackwell B200 and GB200 Chips Enter Volume Production, Sold Out Through Mid-2026
NVIDIA's Blackwell architecture AI chips entered full volume production in early 2025, ramping shipments to major cloud providers including Microsoft, Oracle, AWS, and Meta. With a backlog hitting 3.6 million units, the entire Blackwell lineup is sold out through mid-2026. NVIDIA's data center revenue surged to $30.8 billion, a 112% year-over-year increase.
TSMC Produces First NVIDIA Blackwell Wafer in the U.S., Reports 72% AI Market Share
TSMC and NVIDIA celebrated the production of the first Blackwell wafer on U.S. soil at TSMC's Phoenix facility. TSMC ended 2025 with a 30% jump in revenue and 72% market share in AI chip fabrication. Analysts project TSMC will sustain over 50% annual growth in AI-related chip revenue through 2029.
TSMC CoWoS Advanced Packaging Fully Booked; NVIDIA Secures Over 60% of Capacity
TSMC's entire CoWoS advanced packaging lineup is fully booked, driven by AI and HPC orders from NVIDIA, Google, Amazon, and MediaTek. NVIDIA alone secured over 60% of TSMC's CoWoS capacity, with total demand growing from 370,000 wafers in 2024 to 670,000 wafers in 2025.
SEMI Reports 18 New Semiconductor Fabs to Start Construction in 2025, Equipment Spending Tops $107 Billion
The semiconductor industry is set to begin construction on 18 new fabs in 2025, with most expected to begin operations between 2026 and 2027. Leading regions include the Americas and Japan with four projects each. Worldwide 300mm fab equipment spending is expected to surpass $100 billion for the first time, growing 7% to $107 billion in 2025.
HBM4 Specification Released; SK Hynix Leads with 62% Share as AI Memory War Intensifies
JEDEC released the official HBM4 specification, doubling the interface width to 2,048 bits and enabling up to 2 terabytes per second bandwidth per stack. SK Hynix led the HBM market with 62% share, followed by Micron at 21% and Samsung at 17%. The global HBM market grew from $38 billion in 2025 toward a projected $58 billion in 2026.
Global Silicon Wafer Shipments Rise 6% in 2025, AI-Driven Demand for Advanced Wafers Leads Recovery
Worldwide silicon wafer shipments in 2025 increased approximately 6% to 12,973 million square inches, while revenue reached $11.4 billion. Growth was led by strong demand for advanced epitaxial wafers in AI logic chips and polished wafers for high-bandwidth memory. Mature-node inventory began normalizing after extended correction.
Semiconductor Materials Market Hits Record $73.2 Billion in 2025, Specialty Gases Demand Surges with AI Fabs
The global semiconductor materials market reached a record $73.2 billion in 2025, up 6.8% year-over-year, driven by AI chip manufacturing expansion. Specialty gases including ultra-high-purity argon, krypton, neon, and etching gases saw surging demand as new fabs ramped production for AI accelerators. The specialty gas market is projected to reach $22.49 billion by 2034.
Silicon Carbide Semiconductors Emerge as Key Enablers for AI Data Centers and EVs in 2025
Silicon Carbide (SiC) semiconductors became critical components for AI data center power infrastructure in 2025, as large language models demanding multi-megawatt clusters strained traditional silicon-based power systems. Wolfspeed and STMicroelectronics completed the transition to 200mm SiC wafer production. The global SiC semiconductor market, valued at $3.4 billion in 2025, is projected to reach $24.2 billion by 2035.
